| 1. | These passive circuit elements, as they are often called, are of three main types .
通常所说的无源电路元件有三种主要类型。 |
| 2. | Chapter five discusses the passive circuit correlated our text
第五章的内容是与本课题相关的无源电路。 |
| 3. | A passive circuit element
中性的电路元件 |
| 4. | Since a network is composed of passive circuit elements , we must first define the electrical characteristics of these elements
由于一个网络是由各种无源的元件所构成，我们必须先确定这些元件的电特性。 |
| 5. | This passive circuit exhibits a measured 2db insert loss and 11db return loss . also , the theory of 3db power splitter is described
实测结果表明经过改进的功率分配/合成网络在30 . 53ghz到39ghz范围内损耗小于2db ,回波损耗优于10db 。 |
| 6. | The utilization of the modal analysis in computer aided analysis ( caa ) of microwave and millimeter - wave waveguide passive circuits is studied in this dissertation
本论文主要研究了模式分析法在波导无源电路计算机辅助分析中的应用。 |
| 7. | The dissertation is mainly on the theory and design of the frequency doubler - power amplifier sets of ka - band . in the passive circuit , we analyzed the characteristic of microstrip and coupled microstrip
在无源电路部分，我们首先对微带线、耦合微带线的传输特性和微带-波导过渡的基本原理进行了分析。 |
| 8. | In the passive circuit part , according to the theories of microstrip line and coupled microstripwe , the characteristic of microstrip and coupled microstrip was analyzed , the x band filter and dc block circuit of amplifier have been designed by hp - ads software
为毫米波设备提供本振源。在无源电路部分，我们首先对微带线、耦合线等基本理论作了简单的介绍。 |
| 9. | The insert loss of the passive circuit is less than 3 . 5db , return loss better than 10db . the ammic5040 is used to drive the tga1141 , and the power is splited into two signals , each of these is to drive tag4517 . at the output port , the power is 4w
无源网络损耗小于3 . 5db ,回波损耗优于10db 。第一级放大器采用ammc5040以驱动tga1141 ,通过功率分配器将信号分为两路以驱动两路tga4517功率放大器。最后获得了4w连续波功率输出。 |
| 10. | Thanks to this new technology that has the greatest ever flexibility to layout conducting circuitry in a three - dimensional fashion , many new compact passive circuit implementations that were considered impossible to realize with traditional processes have been used for various wireless applications widely , particularly for radio frequencies ( rf ) front - ends
目前低温共烧陶瓷( ltcc )技术已经成为实现无源元件(包括电感、电容等)集成的关键的主流技术,它在三维多层电路的设计上具有极大的灵活性。 |
